GSO IEC 60191-5:2015

IEC 60191-5:1997

Gulf Standard Current Edition · Approved on 03 September 2015

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

GSO IEC 60191-5:2015 Files

English 71 Pages

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GSO IEC 60191-5:2015 Scope

This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).