GSO IEC 60191-6-13:2023
GSO IEC 60191-6-13:2015
IEC 60191-6-13:2016
Gulf Standard
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English
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Prepared By
KOWSMD
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
التقييس المكيانيكي لأشباه المواصلات – الجزء 6-13: إرشادات التصميم للمقابس المفتوحة من أعلى لمصفوفة شبكات كرات دقيقة السنون (FBGA) مصفوفة شبكة أرضية دقيقة السنون (FLGA)
Project is completed and standards documents are published.
GSO IEC 60191-6-13:2024
Current Edition
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
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Basic Details
Related Standards
Electrical Sector
Proposed and Prepared by
KOWSMD
International Classification of Standards (ICS)
31.080.01
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Semiconductor devices in general
Project Scope
IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.